Power MOSFET 27N3LH5 for SMT design

I want change existing through-hole type PCB design to SMT design. The existing design use Power MOSFET 27N3LH5 in TO-220(DIP) package and with Heat Sinks in output channels. The SMD version of 27N3LH5 is DPAK package. The difference is that DPAK version have Total dissipation (P tot) 30W, whereas TO-220 have 45W.
Can I safely use 27N3LH5 in DPAK package, without Heat Sinks? Power Supply is +12VDC, and current up to 2A per channel.